|Semiconductor IC Production|
Semiconductor IC Production – From Silicon To Packaged Chip
By Dr Holly Ott
Date : 19th April 2011 ( 1 Day )
Location : Singapore
Who Should Attend : This course is suitable for both engineer and non-engineer ( sales/marketing engineer, finance officer, human resource officer, government officer ) who need an overview of the IC production process in 1 day.
Cost Fee : S$400 per person
This course is designed to give a friendly but comprehensive view of the semiconductor IC production for anyone already working in any one part of IC production, for newcomers to the field, or for support staff (Sales & Marketing, Assembly & Packaging, HR or Finance) in a semiconductor firm. It covers the very basics of semiconductor devices, the essentials of front-end wafer fabrication and back-end assembly, and include critical topics such as quality, masks, and technologies. With this framework as a reference, each individual contributor can better understand their role and impact in the entire process, and use this framework to improve their performance and productivity, to facilitate communication with upstream and downstream partners, and to have a better appreciation for this fascinating industry.
Semiconductor Theory and Basic Device Operations
Review of semiconductor material properties, doping, P-N junctions, diode operation, MOSFET operation, BJT operation, and overview of IC design
Device dimensions, critical feature size, design rules, CMOS, BiPolar, III-V technolo-gies, Power Devices.
Wafer Fab: Cleanroom Concept
Overview of the wafer fab, Front-End and Back-End processes, cleanroom concept, wafer sizes
Front End Processing
Overview of thin film deposition, photolithography, etch, implant, CMP
What is a mask set, role in product development, mask making
Overview of defect monitoring, in-line electrical test, metrology, and final wafer test
Quality and Reliability
Typical FE quality and reliability issues, reliability monitoring, lot dispostition, process
Back End Assembly
Assembly stages: pre-assembly, chip mounting, encapsulation, test, modules, silicon-in-
Overview of current technology trends and new growth areas of electronics
About Dr Holly Ott
Holly holds a Ph.D. in Electrical Engineering in semiconductor material characterization and device modeling and has worked for twelve years in semiconductor production in the USA, Europe and Asia for JVs with Siemens, Motorola, IBM and Infineon. Most recently she played a key role in the transfer of Infineon's wireless operations from Germany to Singapore. Her work has been in the areas of device simulation and matching, volume electrical and reliability testing, and operations and supply chain management. Currently, Holly is an adjunct professor in the business schools at Singapore Management University and at SIM University in Singapore. Previously she has taught in the Electrical Engineering department at Virginia Commonwealth University and has developed and taught a variety of technical and non-technical training programs for Infineon Technologies which have been used regularly for staff development throughout Asia and Europe. She is active with the Singapore Semiconductor Industry Association to support training and development needs for semiconductor companies in Singapore.
Please register online at www.spyrotechnology.com.